GF Research – Supposing is good, but finding out is better.

Where it all began

Lead-free electronic solder research was where we started back in 1997, when there was an urgent need for Pb-free materials in the electronic products worldwide due to health concerns.

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NOVEL THERMOELECTRICS

Advanced thermoelectric materials with high figure of merit, for both cooling application and power generation, has also attracted great attention in the late 1990s.

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WASTE ELECTRONICS

Waste Printed Circuit Borads (WPCBs) are also considered as urban mine containing great amout of precious metals, the content of which is even higher than that in their ores.

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Microelectronic Packaging Interconnect Materials and Reliability

Composite and alloying appoaches were applied to modify the service capability of

Novel Materials and Printing Technology for Flexible Electronics

Flexible electronics featured by bendability and/or stretchability enable unconventional

Advanced Thermoelectric Materials with High Figure of Merit

Thermoelectric materials, which capable of directly convert waste heat of electricity were

Recycling, Recover, and Reuse of Waste Electronic Products

Printed circuit boards (PCBs) represent one of the most complicated and valuable

About Research Group

Analyzing the detrimental effects of the mass transport under high current density. Understanding how thermoelectric power factors balance the best. Exploring new noble metal leaching solutions from waste printed circuit boards. Producing new and inspiring interconnects for smart vehicle electronics. These are just a small sampling of the different types of research and creative activities taking place at our lab on a daily basis.

Remarkable Journey

Research and creative activity is about discovery. It’s about having an idea and finding the right environment in which to explore that idea.

Latest Events

IEEE CCET 2021

13 Aug 2021
Transport Properties of Cu2S/Ag Thermoelectric Materials

16 Aug 2021
Thermomechanical Fatigue of Novel Solder Joints in Automotive Applications

18 Aug 2021

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200+

JOURNAL ARTICLES

10+

MILLION GRANTS RECEIVED

20

RESEARCH MEMBERS

Publications and Beyond

Research and creative activity is about discovery. It’s about having an idea and finding the right environment in which to explore that idea. At our Lab of Electronic Packaging Research, we take great pride in our ability to provide supportive environments for the exploration of all types of ideas. Our collaborative and interdisciplinary efforts by student and faculty researchers aim to gain new knowledge and pursue new discoveries in improving society and helping drive human advancement.

Publication is only one of the many ways we serve our community by creating understanding and advancing public awareness. Listed in the publication section are our latest books, journal articles, and conference talks we delivered to the public.

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Metal recovery from waste printed circuit boards: A review for current status and perspectives.

Hao J J, Wang Y S, Wu Y F, Guo F.

Publisher Website

Improvement of thermoelectric properties via combination of nanostructurization and elemental doping.

Y. T. Shu, R. Zhao, F. Guo, et al.

Publisher Website

Composite lead-free electronic solders

F. Guo

Publisher Website

Lead-free solders with rare earth additions

F. Guo, M. Zhao, Z. Xia, Y. Lei, X. Li, and Y. Shi

Publisher Website

2001-2003

Postdoctoral Research Associate

Michigan State University, East Lansing, USA
November 2001

Ph.D

Michigan State University, East Lansing, USA
March 1997

M.S.

Beijing University of Technology, Beijing, China
July 1994

B.S.

Beijing University of Technology, Beijing, China